# Technology & Semiconductors

Datasheets for system integrators, API docs for developers, security attestations for buyer security teams — three product surfaces, three audiences, one engineering discipline.

in :: tech.unified

**DATASHEET** 16-Bit SRAM

**VDD** 3.3V ±5%  
**tACS** 2.5 ns max

**API REFERENCE**  
Payments API  
POST /v3/payments  
Auth Bearer + idem

**SOC 2 · CC6.1**  
Access Controls  
Control  
SAML + MFA  
Evidence  
IdP logs

one engineering discipline · CI/CD-driven publishing  
three registers · one engineering practice · release-tied cadence

## Three Product Surfaces

Technology and semiconductor companies ship three distinct documentation surfaces — one for system integrators reading datasheets, one for developers reading API reference, one for buyer security teams reading SOC 2 narratives. Each carries its own typographic register, structural conventions, and audit-trail obligations. Engineering documentation discipline is what makes the three live in the same content system without losing their distinct shapes.

- ### Hardware & Silicon Documentation
  
Datasheets, application notes, and reference designs for semiconductor vendors — JEDEC-conformant, EDA-toolchain-integrated, version-aligned with silicon respins. PCB design files, IPC-conformant assembly docs, and FCC certification packages for consumer electronics, networking equipment, and IoT devices.

- ### Software & API Documentation
  
Developer-facing reference docs, integration guides, and code samples. Auto-generated from OpenAPI specs where possible; hand-authored where developer experience requires editorial care. Versioned release notes and changelogs tied to semantic-version tags; aggregated views for buyers tracking platform adoption.

- ### Security & Compliance Documentation
  
SOC 2 reports, ISO 27001 statement of applicability and control narratives, penetration test reports, NIST 800-series mappings. The documentation buyer security teams review before signing — and the audit-trail evidence the next year's auditor walks through. ITAR/EAR handling where defense-tech and dual-use export controls apply.

## Continuous Publishing Cadence

The operational arc from source to released documentation — five gated stages tying the publishing cadence to each surface's release cycle (silicon respin, semantic-version release, audit cycle).

1. 01
   
   ### Source-of-Truth Authoring  
   
   Author against the single content source  
   
   Hardware specs, API references, and control narratives written into a structured CCMS with metadata that survives the publishing pipeline. EDA toolchain integration syncs silicon revisions; source-control hooks keep API specs aligned with code.

2. →
3. 02  
   
   ### Validation Pass  
   
   Validate against schemas and business rules  
   
   Schema validation catches structural drift; business-rule validation catches semantic violations (datasheet-vs-silicon drift, API-vs-implementation drift, control-narrative-vs-evidence drift). Failures return to the author before publishing runs.

4. →
5. 03  
   
   ### Auto-Generation  
   
   Generate machine-readable docs from source  
   
   Where source is structured (OpenAPI specs, EDA output, IdP provisioning logs), the publishing pipeline auto-generates the relevant documentation surfaces. Hand-authored content layers on top where editorial care is required.

6. →
7. 04  
   
   ### Pre-Release Build  
   
   Build outputs for every target surface  
   
   PDF datasheets for distribution. Web-ready API reference for developer portal. SOC 2 control narrative for the auditor. Output formats generated in parallel from one source, each in its target typographic register.

8. →
9. 05  
   
   ### Release-Tied Publication  
   
   Publish on the release cadence  
   
   Hardware: tied to silicon respin or product launch. Software: tied to semantic-version release. Security: tied to annual audit cycle plus continuous evidence collection. The publishing cadence matches the release cadence — no doc lag.